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神机
2009-11-27
1. LG enV TOUCH
2. BlackBerry Curve 8520
3. HTC Hero
4. HTC Touch Pro2
5. Nokia E71x
6. Motorola DROID
7. BlackBerry 9700
8. iPhone 3GS
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RF chip maker Telegent files IPO
2009-11-24
From: EETimes
SAN JOSE, Calif. -- Telegent Systems Inc. (Sunnyvale, Calif.) has filed a registration statement with the U.S. Securities and Exchange Commission relating to the proposed initial public offering (IPO) of its common shares.
Goldman, Sachs & Co. and J.P. Morgan Securities Inc. are acting as joint book-runners, and Jefferies & Co. Inc. Oppenheimer & Co. Inc. and Piper Jaffray & Co. are acting as co-managers for the proposed offering.
Telegent's TV receivers are single-chip CMOS solutions, enabling the reception of free-to-air broadcast TV in mobile handsets, laptops and netbooks, and other portable devices.
Telegent recently announced a single-chip CMOS hybrid TV receiver, designed to allow the integration of live analog TV (PAL/SECAM/NTSC) and Europe's DVB-T digital TV in laptops, netbooks and mobile internet devices. Telegent, by adding digital TV reception capability to its claim-to-fame analog TV receiver, hopes to muscle its way into the PC TV market.
In ICs, IPO are rare these days. But one company, MaxLinear Inc., a provider of CMOS-based radio-frequency analog and mixed-signal semiconductors, recently announced that it has filed a registration statement on Form S-1 with the Securities and Exchange Commission for a proposed initial public offering.
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再分享另外一则消息：
”据悉华平将整合旗下投资的锐迪科、互芯、智多微等多家微电子公司登陆NASDAQ，三家公司合并后将拥有完整的手机及智能手机解决方案。融资价值也将大幅度提升。“
Nasdaq啊！看看先烈们的惨状，还敢去吗？要是能在台湾上市就好了！
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Keithley sells RF product line to Agilent
2009-11-24
From: EETimes
CAMBRIDGE, UK — Seeking earlier profitability, Keithley Instruments has signed a definitive agreement with Agilent Technologies to sell substantially all of its RF product line to Agilent, for approximately $9 million.
Because we have placed a high emphasis on profitability in fiscal 2010 and beyond, we concluded that we could no longer continue to support our significant investment in RF measurement products, and should instead focus on growing our core business, stated Joseph P. Keithley, the Companys Chairman, President and Chief Executive Officer.
The CEO explained how the impact of the economic downturn changed the expected timing of the returns the company was anticipating from its RF product line.
The returns were extended beyond a time-frame that the company was willing to continue to support.
Both Keithley and Agilent will work to provide high quality service and support through the transition for the customers using these products.
Subject to the completion of customary closing conditions, it is anticipated that the transaction will close around November 30, 2009. Following the closing, it is anticipated that the majority of the RF team will become Agilent employees.
Under the terms of the agreement, the Company will transfer substantially all of the assets associated with the RF product line and Agilent will assume certain related liabilities.
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Agilent太威武了！不仅经济危机下巍然屹立，还可以借机吃点小虾米！
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From: EETimes
8. Resistive RAM or the memristor
The pursuit of the universal memory goes on. It needs to be simple like a DRAM, or preferably even simpler as those capacitors are a problem to scaling. It needs to be able to retain data for years with the power off and able to be used millions of times. It needs to be simple to make using conventional methods and with materials that are not out of place in conventional wafer fabs. And we still haven't found it yet.
Or have we?
In 2009 Unity Semiconductor Corp. emerged from seven years of stealthy research with its conductive metal oxide (CMOx) technology, although we are pleased to note that EE Times was reporting on Unity in April 2006. But 2009 has also seen the arrival on our radar screens of 4DS Inc., Qs Semiconductor Corp. and Adesto Technologies Inc.
We are also aware that many of the larger IDMs are active in RRAM. And the reference to the memristor is because two-terminal devices that display a memory-effect in their resistance characteristic are effectively the practical implementation of the theoretical work, championed by Hewlett-Packard Labs, on the memristor, often described as the fourth passive circuit element after resistors, capacitors and inductors.
9. The through-silicon via
The depth of the interconnect stack on top of the leading-edge silicon surface is deep and can vary markedly in minimum geometry. We have speculated that this could result in a splitting of front-end fab production into surface and local interconnect followed by higher stack connection, possibly in different wafer fabs.
The desire, for marketing as well as technical reasons, to mount multiple die in single packages is also driving a need for more sophisticated interconnect and the arrival of the through-silicon-via passing completely through a silicon wafer or die is clearly important in creating 3-D packages.
In May 2009 Austriamicrosystems started producing TSV parts on a foundry basis, targeting suppliers of devices for 3-D integration of CMOS ICs and sensor components. Expect more of the same in 2010.
10. Various battery technologies
We have become so used to Moore's law and the steady miniaturization of microelectronics it is easy to become frustrated with a technology that does not double in performance every two years. But battery technology is relatively mature and is not driven by the same forces as the integrated circuit. Indeed if energy storage becomes too dense it can become dangerous.
Nonetheless we all rely increasingly on batteries for energy storage and to power our various gadgets. Indeed it is arguable that without further breakthroughs in battery technology for electric vehicles the compatibility of the automobile and sustainable green transportation is in jeopardy. So the pressure is on.
Recent spins on nickel- and lithium-based battery chemistries, such as nickel oxyhydroxide, olivine-type lithium iron phosphate and nanowires, are gunning to displace the venerable but problematic alkaline-manganese dioxide formulations. ReVolt Technology, a developer of rechargeable zinc-air batteries, has selected Portland, Oregon as the location for its U.S. headquarters and manufacturing center. We expect similar developments to come on apace in 2010, and every smart battery is set to provide a power management IC opportunity.
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From: EETimes
6. Energy harvesting
Energy harvesting is not a new idea. We have had the motion-powered wristwatch for many years. But as electronic circuits move from consuming milliwatts to consuming microwatts an interesting thing happens. It becomes possible to contemplate drawing power for those circuits, not from the electricity grid or from a battery but from a variety of ambient phenomena. And this is expected to have far-reaching impact.
One of the early applications is to have vibration-powered, wireless sensors in place on machinery, in vehicles. The battery-less aspect of such sensors removes the need for maintenance. EnOcean GmbH (oberhaching, Germany) has pioneered the use of wireless, batteryless switches for use in building automation and is now helping to drive the EnOcean Alliance to form standards.
Nokia is looking at energy harvesting in the context of the mobile phone but has stressed it has no prototype as yet. But in 2010 all makers of mobile equipment have to be looking at energy harvesting to, at least, augment the battery life of their equipment.
7. Bio-electronics and wetware
This might be a bit more on the research side than the development side for 2010, but the coming together of the biological and the electronic is ripe for exploitation. We are used to the inclusion of hardware within animals in the form of under-the-skin tags for animals and heart pacemakers for human beings and the need to improve and reduce the cost of medical care is being felt acutely.
As the industry's capabilities in MEMS and organic electronics fabrication improves the scope for integration of tissues and electronic circuitry increases. Lab-on-a-chip is one manifestation of the technology, and here is an example from IBM disclosed recently, but it is also possible to grow biological cells on electronically addressable substrates. The opportunities for in-vitro diagnostics are clear. Information about the electrical behavior of individual cells and their reactions to drugs is a major focus for research in cardiac and neural ailments such as Alzheimer's or Parkinson's disease.
So, in short, we expect a lot of research and the continued emergence of bio-electronics as a mainstream activity.
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- 神机
- RF chip maker Telegent files IPO
- Keithley sells RF product line to Agilent
- Ten emerging technologies to watch in 2010: IV
- Ten emerging technologies to watch in 2010: III
- Ten emerging technologies to watch in 2010: II
- Ten emerging technologies to watch in 2010: I
- NASA looks to SiGe for radiation-immune circuits
- 802.15.4 Chipset Market to Approach $155 Million in 2014
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